The photonic integration opportunity
As electronic interconnects approach fundamental limits in bandwidth density and energy efficiency, photonic interconnects — using light instead of electrons to transmit data — offer a path to continued scaling. Integrated photonic circuits require waveguide structures fabricated on chip or on package, with high refractive index contrast between the waveguide core and cladding for efficient light confinement.
The materials challenge: photonic waveguide cores need high RI (above 1.8) with low optical loss, fabricated at low temperature (compatible with back-end-of-line semiconductor processing), and patternable at nanoscale resolution. Kriya's ultra-high RI nanoparticle materials address this need.
RI requirements for photonic structures
Different photonic applications demand different RI values and contrasts:
- Waveguide cores — RI 1.65 to 2.00, with low absorption loss at telecom wavelengths (1310 nm, 1550 nm)
- Waveguide cladding — RI 1.16 to 1.40, providing the RI contrast needed for mode confinement
- Diffractive optical elements — RI above 1.8 for efficient diffraction; higher RI enables thinner structures with equivalent optical power
- Metalens nanostructures — RI 1.95 to 2.00 for maximum phase control per unit height
Kriya's platform covers RI 1.16 to 2.00 from a single supplier, enabling the entire photonic stack — core, cladding, and functional elements — to be sourced and qualified as a system.
Kriya's materials for photonic integration
Kriya offers two material families for integrated photonics:
- 100% solids UV-curable (RI 1.34 to 1.65) — solvent-free formulations for nanoimprint lithography. No solvent-related dimensional artifacts. Suitable for R2R processing of waveguide and DOE structures.
- Sol-gel nanoparticle composites (RI 1.50 to 2.00) — bottom-up synthesised nanoparticles in sol-gel matrices. Thermally cured dense oxide films with excellent optical quality (haze below 0.3%).
Both families offer precise RI control — critical for photonic circuit design where waveguide dimensions and RI are tightly coupled to the operating wavelength.
Diffractive optical elements
Diffractive optical elements (DOEs) manipulate light through engineered surface patterns rather than bulk curvature. Applications include beam shaping, splitting, homogenisation, and wavelength filtering. The efficiency of a DOE depends directly on the RI of the diffractive material — higher RI means greater phase modulation per unit height, enabling thinner, more efficient structures.
Kriya's materials at RI 1.95 to 2.00 enable DOE designs that would require twice the structure height in conventional polymer resists (RI approximately 1.5). This is particularly relevant for manufacturing efficiency: shallower structures are easier to replicate, have better mold release, and achieve higher throughput in NIL processes.
On-chip photonic interconnects
The emerging field of co-packaged optics — integrating photonic components directly with electronic chips — demands materials that can be processed at low temperatures (below 250 degrees Celsius) and patterned at sub-micrometre resolution. Kriya's UV-curable formulations meet both requirements:
- UV cure at ambient temperature — no thermal damage to underlying electronics
- NIL patterning at sub-100 nm resolution for waveguide and grating structures
- Low optical absorption at telecom wavelengths
- Compatible with standard semiconductor packaging processes
Market outlook
The metalens market is projected to reach 3.1 billion USD by 2032 (industry estimate). The broader integrated photonics market, driven by data centre interconnects, LiDAR, and sensing, is growing at a compound annual rate exceeding 20%. Kriya's position as a material supplier — providing the RI building blocks for photonic structures — enables participation across all these applications from a single technology platform.
Engagement model
Kriya works with photonic IC designers, foundries, and packaging companies at the development stage. The typical engagement path:
- Material specification discussion — target RI, processing constraints, substrate compatibility
- Sample provision — standard or custom-formulated grades
- Process integration support — optimising coating and patterning parameters
- Scale-up — from lab samples to pilot and production volumes